High Pressure Laminate, Compact Laminate, Post-forming Laminate, Melamine Faced Chipboard, Copper Clad Laminate Sheets, Methbond Electronic Sheets
THE COMPANY
High Pressure Laminate, Compact Laminate, Post-forming Laminate, Melamine Faced Chipboard, Copper Clad Laminate Sheets, Methbond Electronic Sheets
| Unternehmenstyp | Manufacturer & Trading Company |
| Gründungsjahr | 2001 |
| Gesamtmitarbeiter | 3 |
| Fähigkeiten | OEM,ODM |
| Handelsbedingungen | FOB,CIF,CFR,EXW |
| Land | China |
| Adresse | Weixing District, Cuiwei Road, Henlin Town, Changzhou, Jiangsu |
INSIDE THE FACILITY — 5 PHOTOS
Tell the supplier what you need. Your inquiry will be sent directly to them.
Beschreiben Sie, was Sie suchen, und wir verbinden Sie mit dem Lieferanten.